| Metal Core PCB Capability | ||
|
No |
Item |
Technical data |
|
1 |
Number of Layers |
1-2Layers |
|
2 |
Material |
Aluminum / Copper base |
|
3 |
Final Thickness |
0.5-3.0mm |
|
4 |
Max Size |
1200mm x 600mm |
|
5 |
Insulating Layer Thickness |
50, 75, 100, 125, 150micron |
|
6 |
Min trace Width/Spacing |
6mil/6mil(0.15/0.15mm) |
|
7 |
Copper Thickness |
0.5oz-3oz |
|
8 |
Min hole size |
0.6mm |
|
9 |
Thermal Conductivity |
1.0-4.0W/m.K |
|
10 |
Aluminum Type |
3003, 5052, 6061 etc. |
|
11 |
Breakdown voltage |
2-8KV |
|
12 |
Min Solder Dam |
4mil |
|
13 |
Min Hole Ring |
4mil |
|
14 |
Twist&Bow |
≤0.7% |
|
15 |
Test Voltage |
50-300V |
|
16 |
Solder Mask Colour |
White, Black, Red, Green, Blue, Yellow |
|
17 |
Silkscreen colour |
White, Black |
|
18 |
Tolerance of Profile |
+/-5mil |
|
19 |
Peel Strength |
≥ 1.8 N/MM |
|
20 |
Surface Resistance |
≥ 1*105 M |
|
21 |
Permittivity |
≤ 4.4 |
|
22 |
Disspation Factor |
≤ 0.03 |
|
23 |
Surface Treatment |
HAL(Lead.free), Immersion gold/Tin, OSP, Gold plating |