Flexible PCB Capability

No

Item

Technical data

1

Number of layers

Flex: 1~6layer

Rigid/flex: 2-10layer

2

Min trace Width/Spacing

12 & 18um (base Cu): 0.075/0.075mm

35um (base Cu): 0.1/0.1mm

3

Min Space Between Coverlay Openings

0.2mm

4

Edge of Coverlay Opening to Trace

0.20mm(preferred)

5

Min Space between coverlay & solder pad

0.15mm

6

Polyimide Films

0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils (100µ) as custmer requested.

7

Thermobond Adhesives

Acrylic/Modified Acrylic, Modified Epoxy, Polyimide

8

Copper Foils (RA or ED)

1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)

9

Stiffeners

Polyimide, rigid FR4, PSA, metal, etc.

10

FR-4 in Multi-layer Flex Circuits

Laminated to flex circuit to create rigid flex boards, typically with vias.

11

Surface Finish

Electroless Ni/Au, Electrolytic soft/hard gold,

Tin plating, Imm.Tin, Entek/OSP

12

Solder Resists

Coverlay, Photo-Imagable Resist

13

Hole tolerance

±0.05mm

14

Smallest Drill Size

0.2mm

15

Largest Drill Size

6.35mm

16

Smallest Slot Width

0.35mm

17

Min.spacing between holes

0.15mm

18

Minimum conductor edge to outline edge

≥0.1mm

19

Min Spacing between coverlay & conductor

± 0.15mm

20

Hole to outline edge

≥ 0.10mm

21

Max Layer to Layer Mis-registration

± 0.10mm

22

Tooling tolerances

Steel(Hard) tooling : ± 0.05mm

CNC drill/rout : ± 0.10mm

Knife(Soft) tooling : ± 0.25mm

23

Copper Plated Thickness (PTH only)

8~15um; 20~30um; 30~70um(special)

24

Au thickness

Electroless: Ni/Au   Ni: 2~6um;Au:0.035~0.075um     

Electrolytic soft/hard gold Ni: 2~9um;Au: 0.035~0.1um