No

Item

Technical data

1

Number of Layers

1-2Layers

2

Material

Aluminum / Copper base

3

Final Thickness

0.5-3.0mm

4

Max Size

1200mm x 600mm

5

Insulating Layer Thickness

50, 75, 100, 125, 150micron

6

Min trace Width/Spacing

6mil/6mil(0.15/0.15mm)

7

Copper Thickness

0.5oz-3oz

8

Min hole size

0.6mm

9

Thermal Conductivity

1.0-4.0W/m.K

10

Aluminum Type

3003, 5052, 6061 etc.

11

Breakdown voltage

2-8KV

12

Min Solder Dam

4mil

13

Min Hole Ring

4mil

14

Twist&Bow

≤0.7%

15

Test Voltage

50-300V

16

Solder Mask Colour

White, Black, Red, Green, Blue, Yellow

17

Silkscreen colour

White, Black

18

Tolerance of Profile

+/-5mil

19

Peel Strength

≥ 1.8 N/MM

20

Surface Resistance

≥ 1*105 M

21

Permittivity

≤ 4.4

22

Disspation Factor

≤ 0.03

23

Surface Treatment

HAL(Lead.free), Immersion gold/Tin, OSP, Gold plating